Diamond is the ultimate material for a wide variety of applications because of its outstanding physical properties, including extreme hardness and strength, high thermal conductivity, low thermal expansion, excellent dielectric properties, resistance to chemical attack, and optical transmission over a wide spectral range. Grown and sliced using Patented Lift off Technology from Japan, further processed with our associate's factory in India as per desired cut, shape, thickness, surface polish.
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Synthetic Monocrystalline Diamonds
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Tool Grade CVD
When it comes to cutting tools, coated indexable inserts are responsible for the major share of metal removed throughout machine shops today. New insert grades are introduced continually, and contribute considerably to the improvement of productivity in machine shops.
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Diamond Subsurfasce Laser Marking
We are introducing our innovative and cutting edge Diamond Security Marking System called "SCDiamark". The system is capable of inscribing a mark beneath the diamond surface, 2D or 3D logo marking and serial number or QR code marking within the bulk of the diamond without affecting the polished surface. The mark can be placed upto half a millimeter depth and with various font thickness to make it microscope visible or loupe visible. Our technology uses an ultrafast laser (without any complicated and expensive optics) to quickly put the subsurface mark, no significant energy going inside the diamond, hence negligible changes to the crystal structure and lattice quality, stress level.
The system is suitable for natural and Lab-Grown polished diamonds, it can also be used on plates or block shape diamonds, or on a diamond Seed Substrates for tracking and inventory management during the growth process in the reactor. Contact us for more information, or investment opportunities info@scdtech.co.uk
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Scalpel Blade
Made using Heteroepitaxial growth, a qusi single crystal diamond wafer, made in Europe, cut and polished in India.